United States : China WLCSP Co. Ltd a leading provider of Wafer Level miniaturization technologies for the electronics industry, has confirmed its commitment to the US market with the opening of a new R&D center in Sunnyvale.

The R&D center will support China WLCSP’s regional activities with OEMs and industry partners in the growing mobile handset market.

“The US is a strategic market, which experiencing solid growth in the high end mobile device market,” said Wang Wei, CEO of China WLCSP. “We have several important customers and partners in this country, where we plan to play a leading role over the next few years.”